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MicroSD Card 3TE4

SD Card & MicroSD Card

32GB ~ 512GB

MicroSD Card 3TE4

Features

  • Compliant with SD 6.1 / SD 3.0 / SD 2.0 interface
  • Support Class 10 with UHS-III
  • Adopt 3D TLC NAND flash
  • High performance
  • Targeted for portable and stationary applications
  • S.M.A.R.T. function supported
BORN FOR SUPERIOR PERFORMANCE

Innodisk MicroSD 3TE4 series, supporting class 10 with UHS-I, are specifically designed for industrial PC and embedded applications. The 3.0 series SD card has the latest firmware architecture and Flash algorithms, including superior wear leveling and read disturb management, ensuring the highest reliability and endurance.

Innodisk MicroSD 3TE4 series provides a wide range of capacities from 32GB to 512GB with excellent quality 3D TLC NAND Flash and is fully compliant with SD 6.1, SD 3.0, and SD 2.0 specifications.

With its low power consumption and features above, the Innodisk MicroSD 3TE4 series can be applied to industrial automation, SBC (single-board computer), medical equipment, infotainment, and mobile applications.

Wear Leveling Technology – EXTENDING PRODUCT LIFESPAN

Innodisk adopts innovative wear leveling technology to revolutionize SSD storage methods, thereby improving its lifespan. By applying this technology to both dynamic and static storage blocks, it eliminates the traditional concepts of hot zones and cold zones, achieving full-area wear balance and optimizing the use of every flash memory block.

  Wear Leveling > 

IMPLEMENTED WITH SUCCESS IN DYNAMIC ENVIRONMENTS

INDUSTRIAL / EMBEDDED
INDUSTRIAL / EMBEDDED

Designed for harsh environments, our products offer high durability to meet the demands of industrial automation and embedded systems.

ENTERTAINMENT
ENTERTAINMENT

Our products enhance user experiences in gaming systems and entertainment platforms, ensuring smooth operations and meeting industry standards.

AUTOMATION
AUTOMATION

Enhancing efficiency in automated systems, our products provide precise data management and long-lasting performance in industrial applications.

SPECIFICATIONS

Model NameMicroSD Card 3TE4
Flash Type3D TLC
InterfaceSD 3.0, SD 6.1
Form FactorMicroSD Card
Capacity32GB ~ 512GB
Sequential R / W (MB/sec, max.)90 / 80
P/E Cycle3,000
TBW (Max.)1,363
Storage Temperature-40°C ~ 85°C
Max. Power Consumption0.7W
Max. Channels1
External DRAM BufferN
FeaturesS.M.A.R.T.
Dimension (W x L x H/mm)11.0 x 15.0 x 1.0
Vibration20G@[7 ~ 2000Hz]
Shock[email protected]
MTBF>3 million hours
Warranty3 Years

ORDER INFORMATION

Operating Temperature

Extended Grade 

(-25°C ~ 85°C)

Industrial Grade 

(-40°C ~ 85°C)

32GB

DESDM-32GS06EE1SL

DESDM-32GS06EW1SL

64GB

DESDM-64GS06%E1SL

DESDM-64GS06%W1SL

128GB

DESDM-A28S06%E1SL

DESDM-A28S06%W1SL

256GB

DESDM-B56S06%E1SL

DESDM-B56S06%W1SL

512GB

DESDM-C12S06%E1SL

DESDM-C12S06%W1SL

%. G : 96 layers 3D TLC / K : 112 layers 3D TLC
32GB is only supported by 64 layers 3D TLC

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