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DDR4 Wide Temp. ECC SODIMM VLP

DDR4

ECC Unbuffered Memory

DDR4 Wide Temp. ECC SODIMM VLP

Features

  • Very low profile specialized for use in 1U system
  • ECC DIMM incorporates error correction and detection capabilities
  • Fully tested and optimized for stability and performance
  • Uses original IC to meet strict industrial standards
  • Anti-sulfuration protection against harsh environments
  • JEDEC standard 1.2V (1.26V ~ 1.14V)
  • Operating Environment: -40°C ~ 95°C (Tc)
  • 30μ” Gold Finger, RoHS Compliance and CE / FCC Certification
     
BORN FOR SUPERIOR PERFORMANCE

DDR4 Wide Temperature ECC SODIMM VLP is a compact and a very low-profile module that offers the industry's fastest memory speed with 3200MT/s, and it is fully compatible with the Intel® Purely platform and 1U devices. The modules come equipped with 30μ” Gold Fingers, include single bit error correction and is designed for networking and server use. All are available in 8GB capacities. 2133MT/s, 2400MT/s 2666MT/s and 2933MT/s modules are also available.

VLP DIMM modules are specialized for use in 1U systems, such as blade server data centers, where system height is lower than 1.18 inches. The design of these modules improves airflow inside the system and reduces thermal impact.

ECC function is designed to detect and correct single-bit errors that occur during data storage and transmission. ECC modules use Hamming Code or Triple Modular Redundancy for error detection and correction, and manage error corrections on their own, without requesting that the data source resend the original data.

SAFEGUARDING MODULES WITH ANTI-SULFURATION PROTECTIVE LAYER

Sulfur is pervasive in many industries. When silver alloys in the DRAM chip encounters sulfur gasses a corrosion reaction occurs. This sulfuration causes lower conductivity and can quickly lead to product failure. To avoid this, Innodisk adds a protective layer above the vulnerable parts to safeguard the silver alloys.


   Anti-Sulfuration >  
 

PROVEN RELIABILITY THROUGH 3rd PARTY TESTING

Ensuring the durability and reliability of components is essential for meeting the demands of challenging environments. Our solutions undergo rigorous third-party testing, adhering to stringent industry standards. These tests validate the robustness of our products under extreme conditions, ensuring dependable performance across various applications.

 

Package Drop TestDrop Height 76 cm, ISTA-1A
Thermal Shock-40°C ~ 110°C, 500 Cycles
Military Standard Vibration TestVibration Frequency 10 Hz ~ 500 Hz
MIL-STD-810G 514.7

TAILORED TO YOUR SPECIFIC NEEDS

SIDE FILL

Side Fill reinforces the connection between chips and the board, providing superior protection in environments with high vibration or mechanical stress.

CONFORMAL COATING

Conformal Coating applies a protective acrylic layer over the DRAM PCB, shielding it from harmful elements such as moisture, dust, and corrosive substances.

IMPLEMENTED WITH SUCCESS IN DYNAMIC ENVIRONMENTS

EDGE SERVER
EDGE SERVER

Designed for edge computing, our products ensure stable performance in harsh conditions, supporting real-time data processing at the edge device.

DATA CENTER
DATA CENTER

Driving the backbone of modern computing, our solutions deliver high performance and reliability for data-intensive operations.

COMMUNICATION
COMMUNICATION

Our solutions ensure reliable and uninterrupted performance, supporting networking and critical telecom infrastructure even under heavy loads.

SPECIFICATIONS

Model NameDDR4 Wide Temperature ECC SODIMM VLP
DDR GenerationDDR4 Memory
DIMM TypeECC SODIMM VLP
Speed2133 MT/s, 2400 MT/s, 2666 MT/s, 2933 MT/s, 3200 MT/s
Density8GB
FunctionECC Unbuffered Memory
Pin Number260pin
Bus Widthx72
Voltage1.2V
PCB Height0.7 Inches
Operating Temperature0°C ~ 95°C (Tc)
30μ” Gold FingerY
Anti-SulfurationY

ORDER INFORMATION

P/N

IC Config.

Rank

Temp.

Description

M4D0-8GS1I5EM

1G x 8

1R x 8

-40°C ~ 95°C (Tc)

DDR4 3200 8GB Wide Temperature ECC SODIMM VLP


*Please contact Innodisk for products with other speeds.

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