
M.2
Ultra iSLC Solution
M.2 (P30) 4IE3
Features
- Up to 100K P/E cycle, extending the lifespan by 33x
- Utilizes Ultra iSLC Technology
- Equipped with 112-layer 3D TLC NAND Flash
- Supports temperature -40°C to 85°C
- Supports dynamic thermal throttling for consistent SSD stability
- 5 years warranty and longevity commitment
Innodisk M.2 (P30) 4IE3 is a NVM Express DRAM-less SSD designed with PCIe interface and industrial 3D TLC NAND Flash. It features a PCIe Gen 4 x4 interface and 3D TLC NAND Flash while adhering to the NVMe 1.4 protocol, delivering exceptional performance and high reliability. Equipped with Error Correction Code (ECC) technology, the M.2 (P30) 4IE3 provides comprehensive End-to-End Data Path Protection (ETEP), ensuring secure data transmission between the host system and NAND Flash.
100K P/E CYCLE, 33X LIFESPAN
The M.2 (P30) 4IE3, featuring BiCS5 112-layer 3D TLC NAND Flash and Innodisk's exclusive Ultra iSLC Technology, achieves an industry-leading 100K P/E cycle. This advancement extends the device lifespan by 33 times compared to conventional 3D TLC NAND Flash.

AES 256-bit DATA ENCRYPTION & TCG Opal 2.0 SUPPORT
Innodisk SSDs utilize AES 256-bit encryption, the US government’s standard for securing confidential data, while also supporting TCG Opal 2.0 for enhanced device management and user-friendly authentication.

Wear Leveling Technology – EXTENDING PRODUCT LIFESPAN
Innodisk adopts innovative wear leveling technology to revolutionize SSD storage methods, thereby improving its lifespan. By applying this technology to both dynamic and static storage blocks, it eliminates the traditional concepts of hot zones and cold zones, achieving full-area wear balance and optimizing the use of every flash memory block.

TAILORED TO YOUR SPECIFIC NEEDS
HEAT SINK CUSTOMIZATION
Innodisk provides different types of heat sinks to meet your specific storage needs.

IMPLEMENTED WITH SUCCESS IN DYNAMIC ENVIRONMENTS
SPECIFICATIONS
Model Name | M.2 (P30) 4IE3 |
---|---|
Flash Type | iSLC (3D TLC) |
Interface | PCIe Gen 4 x4 |
Form Factor | M.2 2230 M Key |
Capacity | 40GB ~ 160GB |
Sequential R / W (MB/sec, max.) | 1,800 / 1,450 |
P/E Cycle | 100,000 |
TBW (Max.) | 1,978 |
Storage Temperature | -40°C ~ 85°C |
Max. Power Consumption | 3.3W |
Max. Channels | 4 |
External DRAM Buffer | N |
Features | AES, TCG Opal 2.0, S.M.A.R.T. |
Dimension (W x L x H/mm) | Pure M.2 : 22.0 x 30.0 x 3.5 W/T with heat sink : 25.0 x 30.0 x 15.0 |
Vibration | 20G@[7 ~ 2000Hz] |
Shock | [email protected] |
MTBF | >3 million hours |
Warranty | 5 Years |
ORDER INFORMATION
Operating Temperature | Standard Grade (0°C ~ 70°C) | Industrial Grade (-40°C ~ 85°C) |
40GB | DHM23-40GDH1KCBDF | DHM23-40GDH1KWBDFH |
80GB | DHM23-80GDH1KCBDF | DHM23-80GDH1KWBDFH |
160GB | DHM23-A60DH1KCBDF | DHM23-A60DH1KWBDFH |
For TCG Opal function, the PN Code 10th ~ 12th will be DH2.