Wide Temperature DRAM - Innodisk Corporation
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Wide Temperature (DRAM)

"Wide temperature" is a term used to refer to Innodisk’s extended temperature DRAM modules designed for military and industrial PC-like applications. Wide temperature design is very important in ensuring operation and performance reliability in extreme temperatures. Innodisk’s wide temperature design is one of the most robust in the industry, providing system vendors with an excellent choice for building a variety of versatile applications.


Our wide temperature range design has extended the existing JEDEC standard from 0ºC–85ºC to -40ºC–105ºC, which is something that only Innodisk offers. To ensure that our wide temperature DRAM modules work without error in extreme temperatures, Innodisk carries out comprehensive testing using a thermal stream-like testing tool, together with our own Thermal Calculation Formula and Bulk Airflow Model.


Minimum and Maximum Operating Temperatures

With a temperature range of -40ºC to 125ºC, Innodisk’s wide temperature DRAM is perfect for a wide range of applications, including commercial, industrial (level 1 and 2), wireless, and automotive (Table 1).


Table 1: Industry standards for minimum and maximum operating temperature for various DRAM modules.

 DRAM operating temperature



State-of-the-Art Testing Processes


Innodisk’s wide temperature DRAM modules deliver reliable performance. They have also gone through the following engineering procedures and validation processes, which were developed in-house.



TJ = Real temperature of IC execution and real situation of thermal conductivity.

TC= Case temperature less than 85ºC (general), 95ºC (industrial), 105ºC (automation).

Formula 1: Proprietary Thermal Calculation Method

Innodisk surpasses JEDEC EAI/JESD51 standards. We include more parameters in our thermal calculation, ensuring that the results are more realistic and true to the actual working environment. All Innodisk wide temperature DRAM modules have to pass the  calculation formula above.


 Four Ambient Testing Points

Graph 1: Four Ambient Testing Points

Innodisk’s wide temperature DRAM modules are tested at four different ambient points inside a system to ensure realistic operational temperature measurements.


 Case Temperature vs. Bulk Airflow Model

Graph 2: Case Temperature vs. Bulk Airflow Model

Innodisk also takes airflow into consideration when testing operational temperature. In specific, we run a wind tunnel test because we believe there can be a difference to the case temperature when there is bulk airflow.